Cutting semiconductor material on a wafer scale requires optics that work with maximum precision - and that’s exactly what Ingeneric has developed.
At first, it is always science fiction. Until someone comes and gets down to business with the idea.
Aluminum, CFRPs and plastics are tomorrow’s most promising candidates for lightweight design. But what plans and visions do their makers have ? Read on to find out.
Micro fusion cutting is the alternative to cold ablation with scanners.
First cut, then weld. At THE Machines lasers are used to ensure that the coil never ends.